发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPACER FORMATION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition for spacer formation capable of easily forming highly flexible spacers of different heights simultaneously with bumps. <P>SOLUTION: A positive photosensitive resin composition with mass average molecular weight of 60,000 or more is used that contains an alkali soluble resin with mass average molecular weight of 60,000 or more containing a constitutional unit (a1) represented by the general formula (a-1) and a constitutional unit (a2) having a crosslinkable group, the proportion of the constitutional unit (a1) exceeding 40 mol%, and a quinone diazide group-containing compound. In the alkali soluble resin, the proportions of the constitutional unit (a1) and the constitutional unit (a2) are preferably 50-80 mol% and 20-50 mol% respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010054809(A) 申请公布日期 2010.03.11
申请号 JP20080219689 申请日期 2008.08.28
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TAKEUCHI HIROAKI;MIZUSAWA TATSUMA
分类号 G02F1/1339;G03F7/023 主分类号 G02F1/1339
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