| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus for decreasing the size of the apparatus as a whole and reducing material cost and production cost, and a method for manufacturing the same. <P>SOLUTION: To provide the semiconductor apparatus includes: a semiconductor device 11 which includes electrodes on front and back surfaces respectively; a first external electrode 12; a second external electrode 13; and an insulator 17. The first external electrode includes a first main surface substantially in parallel with the surface of semiconductor device, a first side face substantially perpendicular to the first main surface and a projection 12a projected in a direction vertical to the first main surface and connected with the electrode on the front surface. The second external electrode includes a second main surface substantially in parallel with the back surface, and a second side face substantially perpendicular to the second main surface, and are connected with the electrode on the back surface of the semiconductor device. The insulator covers the semiconductor device and the projection. The first side face and the second side face are used as mount surfaces, and the semiconductor device is arranged between the first external electrode and the second external electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
