| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper alloy wiring film of a flat panel display and a sputtering target for forming the copper alloy wiring film. <P>SOLUTION: Disclosed are a sputtering target for forming a wiring film of a flat panel display having a composition consisting of 0.1 to 5 at% of Mg, 0.1 to 11 at% of total of one or both of Mn and Al, and if necessary 0.001 to 0.1 at% of P, and the balance of Cu and unavoidable impurities, and a wiring for a flat panel display composed of a copper alloy thin film formed using the target and having a composition consisting of 0.1 to 5 at% of Mg, 0.1 to 11 at% of total of one or both of Mn and Al, and if necessary 0.001 to 0.1 at% of P, and the balance of Cu and unavoidable impurities. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
