| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which hardly generates a crack in a semiconductor element, a connecting member or the like. SOLUTION: The semiconductor device 10 is constituted of a plurality of semiconductor modules 20 with semiconductor elements 21 which are mounted to a cooler 30, and in this case, the cooler 30 includes a first main surface 30B and a second main surface 30C opposed to the first main surface 30B while a plurality of semiconductor module mounting surfaces 30B<SB>1</SB>, 30B<SB>2</SB>, 30C<SB>1</SB>, 30C<SB>2</SB>are formed in zigzag on the first main surface 30B and the second main surface 30C in a sectional view. In this case, the semiconductor module 20 is mounted to a part or all the semiconductor module mounting surfaces 30B<SB>1</SB>, 30B<SB>2</SB>, 30C<SB>1</SB>30C<SB>2</SB>. COPYRIGHT: (C)2010,JPO&INPIT |
