发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that prevents the degradation of wiring reliability, which is caused by a reaction product produced during an etching process. SOLUTION: The method of manufacturing the semiconductor device having a spacer on a sidewall of an electrode includes a step to form an insulating membrane covering the electrode, a step to dry-etch the insulating membrane for forming the spacer on the sidewall of the electrode, a step to remove a reaction product produced by the dry etching, with plasma discharge of hydrogen simple substance gas or gas containing nitrogen, and a step to over-etch, at least, the insulating membrane after the reaction products are removed. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010056574(A) 申请公布日期 2010.03.11
申请号 JP20090277429 申请日期 2009.12.07
申请人 NEC ELECTRONICS CORP 发明人 NANBU HIDETAKA
分类号 H01L21/768;H01L21/3065;H01L23/522 主分类号 H01L21/768
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