| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting silver paste by which soldering can be performed without limitation of curing conditions even if it is in a cured state, and has superior screen printability capable of responding to microfabrication of wiring or the like. Ž<P>SOLUTION: A silver paste contains a silver powder, an epoxy resin, its curing agent and a solvent. In this case, the curing agent of the epoxy resin is a phenol novolak compound, and furthermore, the silver paste contains 0.05-0.5 wt.% of oleic acid with respect to the silver powder. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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