发明名称 |
METHOD OF NICKEL-GOLD PLATING AND PRINTED CIRCUIT BOARD |
摘要 |
Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.
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申请公布号 |
US2010059257(A1) |
申请公布日期 |
2010.03.11 |
申请号 |
US20090369143 |
申请日期 |
2009.02.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI JIN-HAK;LEE SEOUNG-JAE;KIM BAE-KYUN;YANG EUN-JU;KIM JONG-YUN;YOON YEO-JOO |
分类号 |
H05K1/09;B05D5/12 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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