| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component-mounting device used for unloading a component by miniaturizing a component-mounting device and shortening the mounting time, as much as possible. <P>SOLUTION: When a component is removed from each wafer ring 8 and mounted on a ceramic substrate 2, a component in an inner half region of each wafer ring 8 supported by each wafer table 9 provided each parallel in a carrying direction of the ceramic substrate 2, that is, a component in the near region of an area divided into two in distance relation to the other of each wafer ring 8, is first removed. After the component in the inner half region is removed, the wafer table 9 is rotated by 180 degrees in the clockwise direction, and a component in an outer half region is located toward the inside and the removed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
