| 摘要 |
PROBLEM TO BE SOLVED: To provide a resistance evaluation wafer and a resistance evaluation method for precisely evaluating withstand pressure of an insulating film by load from outside in a short time. SOLUTION: The resistance evaluation wafer 100 includes a pair of first wiring 3 and second wiring 4, which are oppositely arranged on a substrate 1 through a low-k insulating film 2, a first connection pad 6 which is connected to first wiring 3 in a pair of wirings through a first via 5 and is disposed on an uppermost layer, a second connection pad 8 which is connected to second wiring 4 in a pair of wirings through a second via 7 and is installed on an uppermost layer, and a plurality of depression pads 9 which are overlapped with a part of first wiring 3 and second wiring 4 in a direction vertical to the substrate 1, are arranged on the uppermost layer through the low-k insulating film 2 as plane terminals in an electrically floating state and are depressed with prescribed load. COPYRIGHT: (C)2010,JPO&INPIT |
