| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board, which is low in an electrical resistance in a through conductor and in an electrical resistance between the through conductor and a wiring conductor, and also which eliminates the lowering of electrical insulation properties between wiring conductors caused by permeation of water. <P>SOLUTION: A laminate 20 for the wiring board is formed by alternatively laminating a plurality of metal wiring conductors 3 and prepregs 1P having a heat resistant fibrous base material impregnated an uncured thermosetting resin composition including a thermosetting resin, a crosslinking material, and a polymerization initiator, wherein between the wiring conductors 3 placed in an up and down direction holding the prepreg 1P are connected with a conductive paste 2P filled in a through-hole V. The laminate 20 is kept at a temperature 20°C higher or less than that of the one minute half life temperature of the polymerization initiator to cure the thermosetting resin composition, and followed by keeping the laminate 20 at a temperature 40°C higher or more than that of the one minute half life temperature of the polymerization initiator to form the diffusion layer of the metal contained in a metal powder between the metal powders in the conductive paste 2P and between the metal powder and the wiring conductor 3. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
