发明名称 |
Mainboard assembly including a package overlying a die directly attached to the mainboard |
摘要 |
Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.
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申请公布号 |
US2010061056(A1) |
申请公布日期 |
2010.03.11 |
申请号 |
US20080231965 |
申请日期 |
2008.09.08 |
申请人 |
SEARLS DAMION;ROTH WESTON C;RAMIREZ MARGARET D;JACKSON JAMES D;THOMAS RAINER E;GEALER CHARLES A |
发明人 |
SEARLS DAMION;ROTH WESTON C.;RAMIREZ MARGARET D.;JACKSON JAMES D.;THOMAS RAINER E.;GEALER CHARLES A. |
分类号 |
H05K7/00;H01L21/56;H01L23/48 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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