发明名称 |
HIGH GAIN READ CIRCUIT FOR 3D INTEGRATED PIXEL |
摘要 |
An image sensor includes (a) a first wafer having (i) a photosensitive area; (ii) a charge-to-voltage conversion region; (b) a second wafer having (i) a first amplifier that receives a signal from the charge-to-voltage conversion region; (c) an electrical interconnect connecting the charge-to-voltage conversion region to an input of the amplifier; (d) an electrically biased shield at least partially enclosing at least a portion of the electrical interconnect.
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申请公布号 |
US2010060764(A1) |
申请公布日期 |
2010.03.11 |
申请号 |
US20080206919 |
申请日期 |
2008.09.09 |
申请人 |
MCCARTEN JOHN P;SUMMA JOSEPH R;ANDERSON TODD J;TIVARUS CRISTIAN A |
发明人 |
MCCARTEN JOHN P.;SUMMA JOSEPH R.;ANDERSON TODD J.;TIVARUS CRISTIAN A. |
分类号 |
H04N5/335 |
主分类号 |
H04N5/335 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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