| 摘要 |
According to one embodiment, an electronic device includes a housing, a circuit board in the housing, a plurality of surface-mountable electronic components, and a reinforcing frame. The circuit board has a first surface and a second surface on a reverse side of the first surface. The surface-mountable electronic components, each having a surface on which bumps are arranged, are mounted on the first surface via the bumps. The reinforcing frame is arranged on the second surface such that it passes through portions corresponding to positions of bumps located at at least four corners of the bumps arranged on the surface of each of the surface-mountable electronic components mounted on the first surface.
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