发明名称 MEMS PROBE CARD AND METHOD OF MANUFACTURING SAME
摘要 <p>The present invention relates to a MEMS probe card and a method of manufacturing same; the MEMS probe card comprises a substrate furnished with via holes whereinto a via hole filler conductor or resistor is charged, a resistance film that is formed on said via hole and substrate, an insulation film that is formed on said resistance film and substrate, and an electrode that is formed on the substrate so as to surround said resistance film and insulation film. By using the above-described MEMS probe card and method of manufacturing same, precise resistance values may be obtained, and responses may be made to power changes in test equipment, such as for semiconductor ICs.</p>
申请公布号 WO2010027145(A1) 申请公布日期 2010.03.11
申请号 WO2009KR03306 申请日期 2009.06.19
申请人 TOP ENGINEERING CO., LTD;KIM, SANG HEE;LEE, SANG HYUN;LEE, JAE SEOK;WOO, CHUN SIK;LEE, JAE IN 发明人 KIM, SANG HEE;LEE, SANG HYUN;LEE, JAE SEOK;WOO, CHUN SIK;LEE, JAE IN
分类号 H01L21/66;B81B7/02 主分类号 H01L21/66
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