PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN, CONDUCTIVE PATTERN, PRINTED WIRING BOARD, LEAD FRAME, BASE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

A photosensitive resin composition providing excellent resolution, adhesion, tinting properties and releasability.  The photosensitive resin composition contains (a) a thermoplastic polymer obtained by polymerizing, as a polymerization component, at least a,ß-unsaturated carboxyl group-containing monomer, and having an acid equivalent weight of 100-600 and a weight average molecular weight of 5,000-500,000, (b) an addition-polymerizable monomer having at least one polymerizable ethylenically unsaturated bond in each molecule, (c) a photopolymerization initiator and (d) a compound represented by general formula (I). (In the formula, R1-R5 independently represent an H, an aryl group or an arylalkyl group, and at least one of R1-R5 represents an aryl group or an arylalkyl group; A1 represents C2H4 or C3H6, and when n1 is not less than 2, the plurality of A1's may be the same as or different from each other; and n1 represents an integer of 1-50.)