发明名称 HYBRID CHASSIS COOLING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an improved method for cooling an electronic circuit system. SOLUTION: In a system for storing electronic circuit cards, a method and a system for cooling the electronic circuit cards are indicated. Preferably, each of the electronic circuit cards includes a heating electronic circuit and a heatsink, is disposed in the card guide of a chassis, and fixed at a fixed position by a holder. At least one of the heatsink, the card guide, the holder, and the cooling wall of the chassis is used to accelerate the conduction cooling of the heating electronic circuits. Furthermore, the holder firmly fixes the card at the fixed position and thus can reduce the influence of vibration (including an impact) applied to the card. Moreover, an air flow cools the electronic circuit cards, the card guide, and/or the cooling walls. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010056527(A) 申请公布日期 2010.03.11
申请号 JP20090151393 申请日期 2009.06.25
申请人 HONEYWELL INTERNATL INC 发明人 IRVING ERIC;PINNEY CHARLES;HENSLEY TOM
分类号 H05K7/20;H05K7/18 主分类号 H05K7/20
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