PURPOSE: A method for manufacturing a thin film device is provided to omit the process for removing the residue of a sacrificial layer using a delaminated face for a junction face to a permanent substrate of a thin film pattern. CONSTITUTION: A sacrificial layer(12) is formed on a first substrate(11). A thin film(14) is formed on the sacrificial layer. A support structure(15) is tack-welded to the thin film. The sacrificial layer is removed in order to separate the thin film from the first substrate. The thin film which is tack-welded to the support structure is welded to the second substrate. The support structure is separated from the thin film.
