发明名称 LIQUID FORM MATERIAL EJECTION METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a liquid form material ejection method and a liquid form material ejection device capable of suppressing increase in process time for determining an arrangement position of droplets, and increase in the load of a control device of the liquid form material ejection device. SOLUTION: In the liquid form material ejection method, an ejection nozzle for ejecting droplets of the liquid form material and a base material with a compartment where the liquid form material is arranged are relatively moved in the main scanning direction, and the liquid form material ejected from the ejection nozzle is arranged in the compartment where the liquid form material is arranged. The method has a step for generating a first arrangement pattern that prescribes the position where the droplets are arranged in the first arrangement compartment, a step for generating a second arrangement pattern that prescribes the position where the droplets are arranged in the second arrangement compartment with a shape similar to the first arrangement compartment, and a step for arranging the droplets according to the second arrangement pattern. The second arrangement pattern is similar in shape to the first arrangement pattern, and whose homothetic ratio to the first arrangement pattern is equal to the homothetic ratio of the second arrangement compartment to the first arrangement compartment. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010054774(A) 申请公布日期 2010.03.11
申请号 JP20080219268 申请日期 2008.08.28
申请人 SEIKO EPSON CORP 发明人 ITO GOJI;KATAUE SATORU;KOMORI SADAJI
分类号 G02B5/20;B05C5/00;B05D1/26 主分类号 G02B5/20
代理机构 代理人
主权项
地址