| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide manufacturing method of a probe substrate which can reduce deformation of probe pins. Ž<P>SOLUTION: This is the manufacturing method of probe cards, including a step to prepare a first substrate (200) which includes a plurality of probe pin formation patterns for forming probe pin (230) and at least one first stress buffering groove (220) for relaxing thermal stress, a step to form the probe pin (230) by filling up the plural probe pin formation patterns with metallic substance, a step to join the surface on which the probe pin (230) of the first substrate (200) is formed with one surface of a second substrate (300), and a step to heat the probe pin (230) with the first substrate (200) and the second substrate (300) joined together and then transfer the probe pin (230) on the second substrate (300). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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