DEVICE AND METHOD FOR TREATING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a device for treating a substrate improving substrate treatment efficiency. SOLUTION: The device 1 for treating the substrate includes: a rotating mechanism 5 holding and rotating a substrate W having a treatment object surface; a supply nozzle 6 for supplying a treatment liquid to the treatment object surface of the substrate W rotated by the rotating mechanism 5; a moving mechanism 7 sequentially moving the supply nozzle 6 to a plurality of supply positions arranged toward an edge of the substrate W; a detection part 8 detecting a surface condition change of the treatment object surface at a part with the treatment liquid supplied thereto by the supply nozzle 6; and a means to control the moving mechanism 7 so that the supply nozzle 6 moves to the next supply position when the surface condition change detected by the detection part 8 is set below an allowable value. COPYRIGHT: (C)2010,JPO&INPIT