LEADFRAME SURFACE WITH SELECTIVE ADHESION PROMOTER APPLIED WITH AN OFFSET GRAVURE PRINTING PROCESS FOR IMPROVED MOLD COMPOUND AND DIE ATTACH ADHESIVE ADHESION

摘要

Placement of an encapsulation material adhesion promoter onto a semiconductor device leadframe can be performed through the use of an offset printing apparatus such as a rotogravure printing apparatus or a tampoprint printing apparatus. This can provide accurate and low-cost placement of the adhesion promoter.