发明名称 |
N2 BASED PLASMA TREATMENT AND ASH FOR HK METAL GATE PROTECTION |
摘要 |
The present disclosure provides a method for making a semiconductor device. The method includes forming a first material layer on substrate; forming a patterned photoresist layer on the first material layer; applying an etching process to the first material layer using the patterned photoresist layer as a mask; and applying a nitrogen-containing plasma to the substrate to remove the patterned photoresist layer. |
申请公布号 |
US2010062591(A1) |
申请公布日期 |
2010.03.11 |
申请号 |
US20090400395 |
申请日期 |
2009.03.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN YU CHAO;CHEN RYAN CHIA-JEN;LIN YIH-ANN;LIN JR JUNG |
分类号 |
H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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