发明名称 N2 BASED PLASMA TREATMENT AND ASH FOR HK METAL GATE PROTECTION
摘要 The present disclosure provides a method for making a semiconductor device. The method includes forming a first material layer on substrate; forming a patterned photoresist layer on the first material layer; applying an etching process to the first material layer using the patterned photoresist layer as a mask; and applying a nitrogen-containing plasma to the substrate to remove the patterned photoresist layer.
申请公布号 US2010062591(A1) 申请公布日期 2010.03.11
申请号 US20090400395 申请日期 2009.03.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN YU CHAO;CHEN RYAN CHIA-JEN;LIN YIH-ANN;LIN JR JUNG
分类号 H01L21/28 主分类号 H01L21/28
代理机构 代理人
主权项
地址