Electronic component device

摘要

An electronic component device includes a package main body (30) constructed by a lower package portion (10) and an upper package portion (20) and having a housing portion (S) in an inside, and an electronic component (40) mounted in a state that the electronic component (40) is hermetically sealed in the housing portion (S) of the package main body (30), wherein at least the lower package portion (10) out of the lower package portion (10) and the upper package portion (20) is formed of silicon, in the case that an optical device as the electronic component (40) is mounted, a transparent glass (34) (light transmission window glass) is provided to an opening portion (20x) formed in the upper package portion (20).