发明名称 FILM FORMING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
摘要 PURPOSE: A film forming apparatus and a substrate processing apparatus are provided to arrange reactive gas nozzles for each process on optimum positions by installing a ceiling panel and the reactive gas nozzles to be removable with respect to a vacuum container. CONSTITUTION: A rotating table(2) includes a plurality of loading areas on which substrates are loaded along a rotating direction. At least two reactive gas nozzles(13, 32) are installed in a vacuum container. The reactive gas nozzles supplies different reaction gases. The vacuum container includes a ceiling panel(11) and a main body(12). The ceiling panel is separated from the main body. An installation unit for the reactive gas nozzles is installed on the peripheral direction of the vacuum container in order to install the reactive gas nozzles to be removable. An exhaust opening exhausts separation gases and reactive gas.
申请公布号 KR20100027040(A) 申请公布日期 2010.03.10
申请号 KR20090080144 申请日期 2009.08.28
申请人 TOKYO ELECTRON LIMITED 发明人 KATO HITOSHI;HONMA MANABU
分类号 H01L21/205 主分类号 H01L21/205
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