PREPARATION OF COPPER THIN FILMS USING COPPER PRECURSOR BY ATOMIN LAYER DEPOSITION

摘要

PURPOSE: A method for manufacturing copper thin films using copper precursor by an atomic layer deposition process is provided to manufacture a thin film which has exact composition and has uniform thickness. CONSTITUTION: A method for manufacturing copper thin films using copper precursor by an atomic layer deposition process comprises following steps. The copper amino alkoxide is supplied to an atomic layer deposition reactor and copper chemical species are adsorbed on a substrate. Copper element and reaction by-products which do not react are eliminated from the reactor. Ligand is removed from the substrate by supplying hydrogen plasma to the reactor. The reaction by-product is eliminated from the reactor.