Elektronenstrahl-Ladungsspeichervorrichtung

摘要

1,229,030. Cathode-ray storage tubes; PN diode arrays. WESTERN ELECTRIC CO. Inc. 17 Oct., 1968 [18 Oct., 1967], No. 49347/68. Headings H1D and H1K. In a cathode-ray storage tube the storage target is provided on the surface scanned by a reading beam with a semi-insulating layer of such thickness that a capacitance is introduced in series with the capacitance of each storage element, the capacitance introduced having such a value in comparison with the target capacitance that the storage elements are only recharged partially during each scan and it is therefore possible to obtain a multiple read out of the stored information. In a scan converter tube with a diode array target as described in Specification 1,222,445, in which reverse biased P-N junction diodes 21 are formed on a substrate 20 and overlain with a silicon dioxide insulating layer 22 and a semi-insulating charge drain layer 24, this latter layer is formed to introduce the additional capacitances of appropriate value in series with the diode junction capacitances. The layer 24 may be a granular mixture of silicon and silicon monoxide providing a capacitance value over the diode junctions of 10-15 to 10-14 Farads with a resistivity value of less than 109 ohm-cms. For junctions of 8 microns diameter the layer thickness is 0À5 to 1À5 microns. Generally suitable materials for the layer 24 are silicon, silicon monoxide, titanium dioxide, gallium arsenide or antimony trisulphide separately or in any combination and in granular or amorphous form. The target includes an impurity gradient region 29 adjacent the input surface to prevent recombination of the minority carriers as described in Specification 1,228,627, and the target structure is manufactured in the manner described in that Specification. The substrate 20 is a slice of monocrystalline N-type silicon, 0-5 to 15 mils thick; the silicon dioxide layer 22 is 0À01 to 1 micron thick, e.g. 0À1 micron; boron is diffused into the substrate 20 to form P-type diode regions 21; and phosphorous is diffused into the substrate at 900‹ C. for 20 minutes to form the impurity gradient region 29 and also to facilitate the making of a good ohmic contact at 25, e.g. by use of vacuum evaporated gold. The substrate 20 has a resistivity of 0À01 ohmcm. forming diodes with capacitances of 10-13 Farads. As an alternative the substrate may be of P-type material and the diode regions of N-type material with the reading beam removing electrons by secondary emission rather than depositing electrons. Reference is also made to the application of the invention to the target of a vidicon camera tube comprising a continuous photoconductive layer.