Electronic component package and method of manufacturing the same

摘要

There is provided an electronic component package (10). The electronic component package includes: a core layer (11) including a plurality of insulating layers formed by impregnating a base material with a resin, wherein a hollow portion is formed in the core layer; core wiring layers (12a, 12b) each disposed between the insulating layers; and an electronic component disposed in the hollow portion. The electronic component and the core wiring layer are electrically connected to each other by a bonding wire.