发明名称 |
CAMERA MODULE MANUFACTURING METHOD FOR PREVENTING FOREIGN SUBSTANCE |
摘要 |
PURPOSE: A camera module manufacturing method for preventing foreign substances is provided to coat a protective film with polymer material on a micro lens unit in a wafer state which is a previous step of a camera module package process, thereby efficiently preventing foreign substances. CONSTITUTION: A camera module manufacturing method for preventing foreign substances comprises the following steps: a step of forming a protective film to cover a micro lens in the wafer state of an image sensor chip(S110); a wafer dicing step of dicing each image sensor chip from a wafer(S120); a die bonding step of installing an image sensor chip on a circuit board(S130); a wire bonding step of bonding an image sensor chip on a circuit board(S140); a step of removing the protective film(S150); a step of housing and lens assembling in which a housing and a lens are installed(S160).
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申请公布号 |
KR20100026692(A) |
申请公布日期 |
2010.03.10 |
申请号 |
KR20080085796 |
申请日期 |
2008.09.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, JUNG JIN |
分类号 |
H04N5/225 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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