发明名称 CAMERA MODULE MANUFACTURING METHOD FOR PREVENTING FOREIGN SUBSTANCE
摘要 PURPOSE: A camera module manufacturing method for preventing foreign substances is provided to coat a protective film with polymer material on a micro lens unit in a wafer state which is a previous step of a camera module package process, thereby efficiently preventing foreign substances. CONSTITUTION: A camera module manufacturing method for preventing foreign substances comprises the following steps: a step of forming a protective film to cover a micro lens in the wafer state of an image sensor chip(S110); a wafer dicing step of dicing each image sensor chip from a wafer(S120); a die bonding step of installing an image sensor chip on a circuit board(S130); a wire bonding step of bonding an image sensor chip on a circuit board(S140); a step of removing the protective film(S150); a step of housing and lens assembling in which a housing and a lens are installed(S160).
申请公布号 KR20100026692(A) 申请公布日期 2010.03.10
申请号 KR20080085796 申请日期 2008.09.01
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JUNG JIN
分类号 H04N5/225 主分类号 H04N5/225
代理机构 代理人
主权项
地址