| 摘要 |
PURPOSE: A jig device for plating multistage printed circuit boards is provided to steadily fix a PCB substrate on a jig by varying the pressure of a ground pin according to the thickness of the PCB substrate. CONSTITUTION: A jig device for plating multistage printed circuit boards comprises a jig frame(10). The jig frame is formed into a lattice form in order to support the PCB substrate. A hanger bar(11) is connected to the both upper sides of the jig frame. A clamp(13) is installed at the end of the hanger bar. The clamp is composed of conductive metal materials and is connected to the power source. A rotating bar(20) is installed on the both sides of the jig frames as a hinge.
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