| 摘要 |
<p>PURPOSE: An apparatus and a method for detecting the warpage of a wafer in a semiconductor exposure process are provided to improve the yield of a wafer by detecting wafer deformation due to the warpage using the auto-focus adjustment function of exposure equipment. CONSTITUTION: A light source unit(1) emits a light. The light transmits through a first slit(3). The light transmitted through the first slit is reflected from a wafer after. The reflected light is transmitted through a second slit(17). The transmitted light through the second slit is detected by a sensor. Based on the detected intensity of the light, the sensor sends a photoelectric signal to an automatic focus connecting board(140) to calculates the auto-focus value of the wafer.</p> |
