| 摘要 |
<p>PURPOSE: A circuit substrate, a method for manufacturing the same and a semiconductor package with the same are provided to arrange the wiring of the circuit substrate on a desirable position by forming a via pattern and a ball land pattern which input/output different signals on an identical position. CONSTITUTION: An insulation body(10) includes a upper side(12) and a lower side(14) which is oppose to the upper side. The insulation body includes a via hole(16) which passes through the upper side and the lower side. A conductive pattern(20) is arranged in the via hole and includes a via pattern part(24) which is projected from the upper side and the lower side. An insulating unit(30) covers the end part of the via pattern part. A ball land(40) is arranged on the lower side and covers the via pattern part.</p> |
