| 摘要 |
<p>The invention relates to a method in which the electronic components (2) are contacted with a carrier (1) consisting of metallic materials and which consists of a flow pipe (1a) which is integrated in the supply line or in the discharge line for the liquid pump (3) and which, on the outer side thereof, has a plate-shaped element (1b) for contacting the electronic components (2). The heat is dissipated from the electronic components (2) over the plate-shaped element (1b) and the flow pipe (1a) of the carrier (1) into the liquid inflowing medium. A further object of the invention is a device for implementing the method, and the use of the device as a cooling device for cooling electronic components (2) for the operation of a cooling water pump in a motor vehicle.</p> |
