发明名称 |
A FLIP-CHIP BONDING STRUCTURE AND A FLIP-CHIP BONDING METHOD |
摘要 |
PURPOSE: A flip-chip bonding structure and a flip-chip bonding method are provided to enhance adhesive force between conductive pads of bump and substrate by forming conductive paste in a bump and to improve the reliability of products. CONSTITUTION: A flip-chip bonding structure comprises a substrate(100) with a plurality of conductive pads(101) for delivering electric signal; an electric device(120) in which a plurality of bumps(121) for the flip chip bonding is formed; and liquid adhesives(110) applied between the substrate and electric device for flip-chip bonding the substrate and electric device. The conductive paste(122) is formed on the bump of the electric device.
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申请公布号 |
KR20100026687(A) |
申请公布日期 |
2010.03.10 |
申请号 |
KR20080085790 |
申请日期 |
2008.09.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, SANG MOO |
分类号 |
H01L23/29;H01L21/60;H01L23/48 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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