| 摘要 |
PURPOSE: A camera module and a manufacturing method thereof are provided to coat the upper surface of a PCB after wire bolding of an image sensor, thereby preventing the movement of foreign materials generated during the manufacturing process of a camera module. CONSTITUTION: A camera module(100) includes a lens unit(110), a housing(120), an image sensor(140), a PCB(130), and a coating layer(150). The lens unit receives an external image. In the housing, the lens unit is installed. The image sensor changes an image delivered through the lens unit into an electric signal. On the PCB, the image sensor is installed. The coating layer attaches movable foreign materials on the PCB by coating the upper surface of the PCB.
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