| 摘要 |
A wholly aromatic polyester amide liquid crystal resin including repeating units of: (I) a 6-hydroxy-2-naphthoic acid residue: 1 to 15 mol %, (II) a 4-hydroxybenzoic acid residue: 40 to 70 mol %, (III) an aromatic diol residue: 5 to 28.5 mol %, (IV) a 4-aminophenol residue: 1 to 20 mol %, and (V) an aromatic dicarboxylic acid residue: 6 to 29.5 mol %, and having a melting point of 270 °C to 370 °C, and having a melt viscosity of 60 Pa·s to 200 Pa·s at a shear rate of 1000/sec at a temperature higher by 10 °C to 20 °C than this melting point is molten at a temperature of the melting point + 40 °C, and extruded at a rate of 0.3 kg/min or more and less than 5 kg/min to form a parison (P). A pair of molds (30) arranged with the parison (P) interposed therebetween are closed under a prescribed mold closing pressure, so that air is blown into the interior of the parison (P). |
