发明名称 |
Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component |
摘要 |
Cold plate apparatuses and methods of fabrication are provided for facilitating cooling of an electronics component. The fabrication approach includes: forming a tube with a first metal and having first and second ends with a heat transfer region disposed therebetween; positioning the heat transfer region of the tube within a mold and casting a heat sink member around the tube by contacting a second metal in molten form over the tube, wherein the first and second metals react peritectically to form an alloy layer between the tube and the heat sink member, and a metallurgical bond is formed between the tube and heat sink member with cooling of the molten second metal; and controlling casting of the heat sink member to minimize a thickness of the alloy layer to enhance a heat transfer characteristic of the metallurgical bond formed between the tube and the heat sink member.
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申请公布号 |
US7673389(B2) |
申请公布日期 |
2010.03.09 |
申请号 |
US20050184654 |
申请日期 |
2005.07.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LEHMAN BRET W.;SCHMIDT ROGER R.;SINGH PRABJIT |
分类号 |
B21D53/02;B22D19/00;B22D19/14;B23P15/26;F28F3/12;H05K7/20 |
主分类号 |
B21D53/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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