Silicon-based packaging for electronic devices

摘要

An electronic device includes a first silicon-based circuit carrying substrate and a die carried by the first silicon-based circuit carrying substrate. The silicon-based circuit carrying substrate is configured to electrically connect the die to other die. The device may include a second silicon-based circuit carrying substrate. The second silicon circuit carrying substrate may be closely coupled to the first silicon-based circuit carrying substrate. The device may also include a second die carried by the second silicon-based circuit carrying substrate.