发明名称 Electronic device package heat sink assembly
摘要 An electronic package includes a flat base having a notch formed at opposite ends of the base. A clamping mechanism has a boss adapted to the notch for matingly connecting to the base, and includes an aperture for receiving a fastener for securing the package to a substrate or heat sink.
申请公布号 US7675167(B2) 申请公布日期 2010.03.09
申请号 US20060452126 申请日期 2006.06.13
申请人 ELECTRO CERAMIC INDUSTRIES 发明人 SCHLOMANN HERBERT W.
分类号 H01L23/34;H01L23/10 主分类号 H01L23/34
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