| 摘要 |
PURPOSE: A repairing apparatus for a ball grid array is provided to reduce a production cost using a low-cost separation apparatus for removing a package including a defect without a vacuum nozzle. CONSTITUTION: A circuit board(100) and a package including a defect are heated by a heating unit. A bracket is fixed on the external side of the package including the defect. On the center of the lower side of the bracket, an weight(320) is installed to separate the package and the circuit board. A carrier jig(400) is installed to load the separated package on the lower side of the circuit board. A mesh for circulating hot air is installed on the carrier jig.
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