| 摘要 |
PURPOSE: A template for forming a solder bump and a method for manufacturing the same are provided to form a receiving groove into a desired shape by selecting the shape of the receiving groove according to the crystal face and the crystal direction of a substrate with a crystal structure. CONSTITUTION: A plurality of receiving grooves(110) is formed on the one side of a template(100). The receiving grooves are formed in points corresponding to the each point of wafer electrode. According to a crystal face and direction, the cross section of the receiving grooves is a trapezoidal shape, a triangle shape or a rectangular shape. The template is a flat shape and composed of a material with a crystal structure. The material with the crystal structure is thermal resistance or chemical resistance material including silicon.
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