METHOD OF MEASURING MISALIGNMENT, AND MISALIGNMENT INSPECTION MARK

摘要

PROBLEM TO BE SOLVED: To obtain a method of measuring misalignment that correctly measures the amount of misalignment of superposition between layers in a pattern of small area.

SOLUTION: In the method of measuring the misalignment of superposition between layers as the amount of misalignment for a semiconductor device which is fabricated by laminating a pattern of a plurality of layers, the distance between a first annular pattern formed annularly of a layer Lu on the overlying layer side and a second annular pattern formed annularly of a layer Ld on the underlying layer side so that the second annular pattern is arranged concentrically to the first annular pattern is measured, and then the amount of misalignment is calculated using the measurements.

COPYRIGHT: (C)2010,JPO&INPIT