| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus, a substrate processing method, a program, and a storage medium which reduce installation spaces of valves provided in respective chemical-liquid supply sources. Ž<P>SOLUTION: A second line 44 is branched from a first line 22 connected to a processing part 10 configured to process a wafer W. A plurality of third lines (an ammonia-water supply line 48, a hydrochloric-acid supply line 52, and a hydrofluoric-acid supply line 56) are branched from the second line 44. The third lines are respectively provided with valves 48a, 52a and 56a at locations branched from the second line 44. Chemical liquid supply sources (an ammonia-water supply source 46, a hydrochloric-acid supply source 50, and a hydrofluoric-acid supply source 54) are connected to the respective third lines, whereby chemical liquids are supplied from these chemical-liquid supply sources to the respective third lines. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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