PIEZOELECTRIC VIBRATING REED MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED CLOCK

摘要

A piezoelectric vibrating reed manufacturing method for manufacturing from a wafer a piezoelectric vibrating reed comprising a pair of vibrating arm portions disposed parallel to each other, a base portion for integrally fixing base end sides of the pair of vibrating arm portions, and groove portions respectively formed in both surfaces of the pair of vibrating arm portions along the longitudinal direction of the vibrating arm portions. The piezoelectric vibrating reed manufacturing method comprises a protective film forming step of forming a protective film in the region other than positions corresponding to the groove portions in the wafer, and a groove portion forming step of forming the groove portions by dry-etching the wafer with the protective film as a mask. In the protective film forming step, a first protective film forming step of forming the protective film with a predetermined thickness on a first surface of the wafer and a second protective film forming step of forming the protective film with a predetermined thickness on a second surface of the wafer are alternately performed a plurality of times.