| 摘要 |
PURPOSE: A semiconductor chip including a via plug, a semiconductor chip stacked structure, and a semiconductor package thereof are provided to reduce electric signal loss and improve area efficiency of a stacked semiconductor chip by using a wafer level redistribution structure which has a fast signal transmission speed. CONSTITUTION: A circuit board(410) includes a semiconductor circuit. A conductivity redistribution structure(440) is formed on the circuit board, and is electrically connected to the semiconductor circuit. A conductivity input-output pad(420) is formed on the circuit board. A conductive via plug(450) passes through the circuit board. The via plug is electrically connected to the input-output pad. The via plug is electrically connected to the redistribution structure. |
