| 摘要 |
PROBLEM TO BE SOLVED: To provide a hardware implementation to be integrated in a silicon component to deliver visibility using an existing external interface from an MCP, e.g., via other interconnect. SOLUTION: Included is a step for selecting first data received in a first die of a multi-chip package (MCP) from a second die of the MCP via an intra-package link for output from a selector during a first clock period of a first clock signal, a step for selecting second data transmitted from the second die to the first die for output from the selector during a second clock period, and a step for transmitting the first and second data from the MCP via an external link. COPYRIGHT: (C)2010,JPO&INPIT |
