PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, METHOD FOR CLEANING PLASMA PROCESSING APPARATUS AND PRESSURE CONTROL VALVE FOR PLASMA PROCESSING APPARATUS

摘要

A plasma processing apparatus (11) is provided with: a first air releasing path (15) extending downward from an air releasing port (13); a second air releasing path (16), which is connected to the downstream end section of the first air releasing path (15) in the air releasing direction, extends in the direction perpendicular to the first air releasing path (15), and has a horizontally long cross-section which orthogonally intersects with the air releasing direction and has a length longer in the width direction than that in the vertical direction; a third air releasing path (17) which is connected to the downstream end section of the second air releasing path (16) in the air releasing direction and extends in the direction perpendicular to the second air releasing path (16); a pump (18) which is connected to the downstream end section of the third air releasing path (17) in the air releasing direction and depressurizes inside a processing container (12); a pressure control valve (21) which is arranged inside the second air releasing path (16), is capable of shutting the second air releasing path (16), and has a pressure control valve plate (20) which controls pressure to the upstream and downstream in the air releasing direction; and a shut-off valve (23) which is arranged inside the third air releasing path (17) and has a shut-off valve plate (22) which opens/closes the third air releasing path (17).