| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which suppresses an increase in the size of a case and reduces the mounting area of a heating component on a circuit board to improve the mounting density of an electronic component, and to provide lighting equipment having the electronic device. <P>SOLUTION: The electronic device 1 includes: a semiconductor element 2 having a body 6, fitting hole 9, and a lead wire 7; a heat dissipating plate 3 which includes a bottom face 10, a sidewall 11, and a sloped portion 12 including a hole 13 corresponding to the fitting hole 9 of the semiconductor element 2, wherein the semiconductor element 2 is fixed to the sloped portion 12 with a fitting member 8 via the fitting hole 9 of the semiconductor element 2 and the hole 13; a circuit board 4 to which the bottom face 10 of the heat dissipating plate 3 is fixed and the lead wire 7 of the semiconductor element 2 is soldered; and a case 5 having a bottom plate 20 disposed opposite to the circuit board 4 and a side plate 21 to which the sidewall 11 of the heat dissipating plate 3 is fixed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
