| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that has improved reliability by preventing a liquid resin from flowing out and protecting a wire on the surface of a chip. <P>SOLUTION: The method of manufacturing a semiconductor device including the steps of: preparing a first plane-view rectangular chip 10 on the surface of which a wire, an electrode pad 14, and a chip mounting region are provided; forming a protective film covering the wire; forming a dam 16 that covers the protective film and surrounds the chip mounting region at a position where a distance between a predetermined side of the chip mounting region and a side opposite to the predetermined side is longer than the distance between the other side of the chip mounting area and a side opposite to the other side on the surface of the first plane-view rectangular chip 10; a flip-flop-mounting a second plane-view rectangular chip 12 in the chip mounting region; and forming an underfill 18 by discharging a liquid resin between a predetermined side of the chip mounting region and a side opposite to the predetermined side of the dam 16. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
