| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a COF (Chip On Film) substrate provided with an easily bendable heat dissipating pattern preventing fracture, with a wiring pattern hardly disconnected. <P>SOLUTION: In a COF substrate 4 including an insulating film 2, the wiring pattern 1 disposed on one side of the insulating film and connected to a semiconductor element, and the heat dissipating pattern 3 disposed on the other side facing the side on which the wiring pattern of the insulating film is disposed, a plurality of opening parts 5 are provided in the heat dissipating pattern in a region where the COF substrate is bent, perpendicularly to the bent direction. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
