| 摘要 |
A method involves depositing a first electrically conductive material, using a deposition technique, into a via formed in a material, the via having a diameter at a surface of the material of less than about 10μm and a depth of greater than about 50μm, so as to form a seed layer within the via, then creating a thickening layer on top of the seed layer by electrolessly plating the seed layer with a second electrically conductive material without performing any activation process within the via between via formation and the creating the thickening layer, and then electroplating a conductor metal onto the thickening layer until a volume bounded by the thickening layer within the via is filled with the conductor metal. |
